Patent Assignment
Reel/Frame 028179/0566
Assignment of Assignor's Interest
Recorded: 2012-05-09
Pages: 3
Assignors
HANAI, NOBUHIRO
Executed: 2012-05-08
ENDO, TAKAYA
Executed: 2012-04-20
TOMIKAWA, MITSUHIRO
Executed: 2012-04-20
Assignee
IBIDEN CO., LTD.
2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Wiring Board with Built-in Imaging Device and Method for Manufacturing Same