Patent Assignment
Reel/Frame 028184/0424
Assignment of Assignor's Interest
Recorded: 2012-05-10
Pages: 4
Assignors
PERIAMAN, SHANGGAR
Executed: 2007-03-23
OOI, KOOI C
Executed: 2007-03-23
CHEAH, BOK E
Executed: 2007-03-23
CHEW, YEN H
Executed: 2007-09-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Die Backside Wire Bond Technology for Single or Stacked Die Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.