IP Library › Assignment 028187/0314
Patent Assignment
Reel/Frame 028187/0314

Assignment of Assignor's Interest

Recorded: 2012-05-10 Pages: 3
Assignors
SUH, DAE WOONG
Executed: 2012-02-28
LEE, CHUNG HOON
Executed: 2012-02-28
Assignee
SEOUL OPTO DEVICE CO., LTD.
1B-36, 727-5 WONSI-DONG, DANWON-GU, GYEONGGI-DO, ANSAN-SI, 425-851, KOREA, REPUBLIC OF
Covered Property (1)
Wafer Level Led Package and Method of Fabricating the Same
Patent: 8,592,232 →
Application: 13/359,287 →
Publication: US 2013/0026518
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 21, 2014
From: SEOUL OPTO DEVICE CO., LTD
To: SEOUL VIOSYS CO., LTD
Reel/Frame 032723/0126 →
Assignment of Assignor's Interest Feb 20, 2025
From: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
To: EDISON INNOVATIONS, LLC
Reel/Frame 070293/0273 →
Assignment of Assignor's Interest Mar 26, 2025
From: GENERAL ELECTRIC COMPANY
To: GE INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 070636/0815 →
Change of Name Mar 26, 2025
From: GE INTELLECTUAL PROPERTY LICENSING, LLC
To: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 070643/0907 →