Patent Assignment
Reel/Frame 028200/0471
Assignment of Assignor's Interest
Recorded: 2012-05-14
Pages: 4
Assignors
HU, YEN CHANG
Executed: 2012-04-10
HSIAO, CHING WEN
Executed: 2012-04-10
CHEN, CHIH-HUA
Executed: 2012-04-10
CHEN, CHEN-SHIEN
Executed: 2012-04-10
KUO, TIN-HAO
Executed: 2012-04-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections