Patent Assignment
Reel/Frame 028203/0226
Assignment of Assignor's Interest
Recorded: 2012-05-14
Pages: 2
Assignors
CHEN, YU-FENG
Executed: 2012-02-29
LIN, CHUN-HUNG
Executed: 2012-02-29
PU, HAN-PING
Executed: 2012-02-29
CHENG, MING-DA
Executed: 2012-02-29
WU, KAI-CHIANG
Executed: 2012-02-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Mechanisms for Forming Connectors with a Molding Compound for Package on Package