Patent Assignment
Reel/Frame 028212/0035
Assignment of Assignor's Interest
Recorded: 2012-05-15
Pages: 3
Assignors
LIN, I-CHIA
Executed: 2012-05-14
TSENG, YU-CHOU
Executed: 2012-05-14
YANG, JIN-FENG
Executed: 2012-05-14
CHUNG, CHI-SHENG
Executed: 2012-05-14
LIAO, KUO-HSIEN
Executed: 2012-05-14
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Packages with Thermal Dissipation Structures and Emi Shielding