Patent Assignment
Reel/Frame 028227/0774
Assignment of Assignor's Interest
Recorded: 2012-05-17
Pages: 3
Assignors
MARKHAM, SHAWN RACHELLE
Executed: 2012-05-07
THOMAS, WINDSOR PIPES, III
Executed: 2012-05-14
Assignee
CORNING INCORPORATED
SP-TI-03-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Non-Polished Glass Wafer, Thinning System and Method for Using the Non-Polished Glass Wafer to Thin a Semiconductor Wafer