Patent Assignment
Reel/Frame 028256/0458
Assignment of Assignor's Interest
Recorded: 2012-05-23
Pages: 17
Assignors
YOON, JUN-HO
Executed: 2012-04-16
KUH, BONG-JIN
Executed: 2012-04-16
KIM, KI-CHUL
Executed: 2012-04-16
MIN, GYUNG-JIN
Executed: 2012-04-16
PARK, TAE-JIN
Executed: 2012-04-16
YANG, SANG-RYOL
Executed: 2012-04-16
OH, JUNG-MIN
Executed: 2012-04-18
WOO, SANG-YOON
Executed: 2012-04-18
YOU, YOUNG-SUB
Executed: 2012-04-18
LEE, JI-EUN
Executed: 2012-04-16
LIM, JONG-SUNG
Executed: 2012-04-16
JANG, YONG-MOON
Executed: 2012-04-16
CHOI, HAN-MEI
Executed: 2012-04-16
HAN, JE-WOO
Executed: 2012-04-16
Assignee
SAMSUNG ELECTRONICS CO., LTD
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of fabricating semiconductor device