Patent Assignment
Reel/Frame 028264/0345
Assignment of Assignor's Interest
Recorded: 2012-05-24
Pages: 3
Assignor
TSURUDA, TOYOHISA
Executed: 2012-05-08
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO-TO, JAPAN
Covered Property
(1)
Substrate Warpage Removal Apparatus and Substrate Processing Apparatus