Assignment of Assignor's Interest

Recorded: 2012-05-24 Pages: 4

Assignor

GESTION TECHNOCAP INC.

Executed: 2012-04-18

Assignee

EFFACED TECHNOLOGIES LLC

160 GREENTREE DRIVE, SUITE 101, DOVER, DELAWARE, 19904

Covered Properties (6)

Chip and defect tolerant method of mounting same to a substrate

Application: 60/343,218 →

Method and apparatus providing reduced thermal expansion effects on the external connectivity of a microelectronic complex

Application: 60/343,219 →

Connector for transporting signals between contact pads on two surfaces

Application: 60/343,243 →

High-density architecture for a microelectronic complex on a planar body

Application: 60/343,244 →

Flexible connecting device for interfacing with a wafer

Application: 60/391,610 →

Connector with fault tolerance

Application: 60/415,802 →

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.