Patent Assignment
Reel/Frame 028277/0615
Assignment of Assignor's Interest
Recorded: 2012-05-29
Pages: 5
Assignors
KUO, FENG-WEI
Executed: 2012-05-24
CHEN, HUAN-NENG
Executed: 2012-05-24
JOU, CHEWN-PU
Executed: 2012-05-24
YEH, DER-CHYANG
Executed: 2012-05-25
WANG, CHUEI-TANG
Executed: 2012-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Novel Bead for 2.5D/3D Chip Packaging Application