Patent Assignment
Reel/Frame 028286/0192
Assignment of Assignor's Interest
Recorded: 2012-05-30
Pages: 2
Assignors
WANG, YUEN-HAN
Executed: 2012-03-12
LU, SHENG-LI
Executed: 2012-03-12
WANG, JIH-FU
Executed: 2012-03-12
CHEN, HSIEN-WEN
Executed: 2012-03-12
YANG, KUAN-YU
Executed: 2012-03-12
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Having Light-Emitting-Diode Solder-Bonded on First and Second Conductive Pads Separated by at Least 75 Um