Patent Assignment
Reel/Frame 028326/0608
Assignment of Assignor's Interest
Recorded: 2012-06-06
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Method for Manufacturing Multilayer Printed Wiring Board