IP Library › Assignment 028360/0661
Patent Assignment
Reel/Frame 028360/0661

Assignment of Assignor's Interest

Recorded: 2012-06-12 Pages: 2
Assignors
LI, MING
Executed: 2012-06-08
TIAN, DEWEN
Executed: 2012-06-08
JANARDHANAN PILLAI, MADHUKUMAR
Executed: 2012-06-12
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property (1)
Bond Pad Assessment for Wire Bonding
Patent: 8,657,180 →
Application: 13/494,499 →
Publication: US 2013/0327812
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 20, 2023
From: ASM TECHNOLOGY SINGAPORE PTE LTD
To: ASMPT SINGAPORE PTE. LTD.
Reel/Frame 062444/0830 →