Patent Assignment
Reel/Frame 028395/0518
Assignment of Assignor's Interest
Recorded: 2012-06-18
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2012-06-11
LII, MIRNG-JI
Executed: 2012-06-11
LIU, CHUNG-SHI
Executed: 2012-06-11
CHEN, MENG-TSE
Executed: 2012-06-11
LIN, WEI-HUNG
Executed: 2012-06-11
CHENG, MING-DA
Executed: 2012-06-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Package on Package Structures and Methods for Forming the Same