Patent Assignment
Reel/Frame 028405/0181
Assignment of Assignor's Interest
Recorded: 2012-06-19
Pages: 4
Assignors
LIM, ZHENG-YI
Executed: 2012-06-18
WU, YI-WEN
Executed: 2012-06-18
YANG, TZONG-HANN
Executed: 2012-06-18
HO, MING-CHE
Executed: 2012-06-18
LIU, CHUNG-SHI
Executed: 2012-06-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Bonding Package Components Through Plating