Patent Assignment
Reel/Frame 028418/0772
Assignment of Assignor's Interest
Recorded: 2012-06-21
Pages: 4
Assignors
TU, CHIA-WEI
Executed: 2012-06-19
KUO, YIAN-LIANG
Executed: 2012-06-19
LU, WEN-HSIUNG
Executed: 2012-06-19
CHEN, HSIEN-WEI
Executed: 2012-06-20
TSAI, TSUNG-FU
Executed: 2012-06-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods for Forming the Same