Patent Assignment
Reel/Frame 028435/0436
Assignment of Assignor's Interest
Recorded: 2012-06-25
Pages: 12
Assignors
FOGEL, KEITH E
Executed: 2004-11-12
GHOSAL, BALARAM
Executed: 2004-11-12
KANG, SUNG K
Executed: 2004-11-12
KILPATRICK, STEPHEN J
Executed: 2004-11-15
LAURO, PAUL A
Executed: 2004-11-12
NYE, HENRY A, III
Executed: 2004-11-15
SHIH, DA-YUAN
Executed: 2004-11-15
ZUPANSKI-NIELSEN, DONNA S
Executed: 2004-11-12
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Interconnections for Flip-Chip Using Lead-Free Solders and Having Reaction Barrier Layers
Application:
13/244,576 →
Publication:
US 2012/0012642
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.