Patent Assignment
Reel/Frame 028792/0676
Assignment of Assignor's Interest
Recorded: 2012-08-15
Pages: 26
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2012-07-18
Assignee
ULTRATECH, INC.
3050 ZANKER ROAD, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(8)
Interconnections for Flip-Chip Using Lead-Free Solders and Having Improved Reaction Barrier Layers
Through Substrate via Including Variable Sidewall Profile
Through Substrate Annular via Including Plug Filler
Application:
13/025,678 →
Publication:
US 2011/0129996
Interconnections for Flip-Chip Using Lead-Free Solders and Having Reaction Barrier Layers
Application:
13/244,576 →
Publication:
US 2012/0012642
Grain Refinement by Precipitate Formation in Pb-Free Alloys of Tin
Solder Interconnect Pads with Current Spreading Layers
Through Silicon via for Use in Integrated Circuit Chips
Solder Mold Plates Used in Packaging Process and Method of Manufacturing Solder Mold Plates
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 25, 2012
From: FOGEL, KEITH E; GHOSAL, BALARAM; KANG, SUNG K; KILPATRICK, STEPHEN J
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 028435/0436 →
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051383/0768 →
Assignment of Assignor's Interest
Dec 30, 2019
From: ULTRATECH, INC.
To: VEECO INSTRUMENTS INC.
Reel/Frame 051446/0476 →