Assignment of Assignor's Interest

Recorded: 2019-12-30 Pages: 4

Assignor

ULTRATECH, INC.

Executed: 2019-12-24

Assignee

VEECO INSTRUMENTS INC.

1 TERMINAL DRIVE, PLAINVIEW, NEW YORK, 11803

Covered Properties (3)

Through Substrate via Including Variable Sidewall Profile

Patent: 8,643,190 →

Application: 12/955,429 →

Publication: US 2011/0068477

Through Silicon via for Use in Integrated Circuit Chips

Patent: 8,637,937 →

Application: 13/364,804 →

Publication: US 2012/0132967

Through Silicon via and Method of Fabricating Same

Patent: 8,735,251 →

Application: 14/046,414 →

Publication: US 2014/0094007

Related Assignments (2)

Other recorded transfers of the patents in this record — the chain of ownership.