IP Library Assignment 028437/0390
Patent Assignment
Reel/Frame 028437/0390

Assignment of Assignor's Interest

Recorded: 2012-06-25 Pages: 3
Assignors
HU, CHUAN
Executed: 2012-06-25
NAIR, VIJAY
Executed: 2012-06-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Single Layer Low Cost Wafer Level Packaging for Sff Sip
Patent: 9,281,292 →
Application: 13/532,119 →
Publication: US 2013/0343022