Patent Assignment
Reel/Frame 028446/0352
Assignment of Assignor's Interest
Recorded: 2012-06-26
Pages: 2
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Method for Soldering Surface-Mount Component and Surface-Mount Component