IP Library Assignment 028450/0244
Patent Assignment
Reel/Frame 028450/0244

Assignment of Assignor's Interest

Recorded: 2012-06-27 Pages: 3
Assignors
HUANG, ALEX
Executed: 2012-06-27
HURWITZ, DROR
Executed: 2012-06-27
Assignee
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
FOUNDERPCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE, QIANWU, DOUMEN, ZHUHAI, 519173, CHINA
Covered Property (1)
Multilayer Electronic Support Structure with Cofabricated Metal Core
Patent: 8,987,602 →
Application: 13/523,102 →
Publication: US 2013/0333924
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 9, 2019
From: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
To: ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
Reel/Frame 049152/0778 →