Patent Assignment
Reel/Frame 049152/0778
Change of Name
Recorded: 2019-05-09
Pages: 5
Assignor
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Executed: 2018-01-17
Assignee
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
FOUNDERPCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE, QIANWU, DOUMEN, ZHUHAI, 519173, CHINA
Covered Properties
(6)
Multilayer Electronic Structures with Integral Vias Extending in in-Plane Direction
Multilayer Electronic Structures with Vias Having Different Dimensions
Multilayer Electronic Structure with Integral Stepped Stacked Structures
Multilayer Electronic Structure with Through Thickness Coaxial Structures
Multilayer Electronic Structure with Novel Transmission Lines
Multilayer Electronic Support Structure with Cofabricated Metal Core
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 21, 2012
From: HURWITZ, DROR
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 028420/0428 →
Assignment of Assignor's Interest
Jun 21, 2012
From: HURWITZ, DROR; CHAN, SIMON; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 028420/0722 →
Assignment of Assignor's Interest
Jun 27, 2012
From: HUANG, ALEX; HURWITZ, DROR
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 028450/0244 →