IP Library › Assignment 028420/0722
Patent Assignment
Reel/Frame 028420/0722

Assignment of Assignor's Interest

Recorded: 2012-06-21 Pages: 5
Assignors
HURWITZ, DROR
Executed: 2012-06-20
CHAN, SIMON
Executed: 2012-06-20
HUANG, ALEX
Executed: 2012-06-20
Assignee
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
FOUNDERPCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE, QIANWU, DOUMEN, ZHUHAI, 519173, CHINA
Covered Properties (2)
Multilayer Electronic Structure with Through Thickness Coaxial Structures
Patent: 9,185,793 →
Application: 13/483,185 →
Publication: US 2013/0319738
Multilayer Electronic Structure with Stepped Holes
Patent: 9,161,461 →
Application: 13/523,116 →
Publication: US 2013/0333934
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name May 9, 2019
From: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
To: ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
Reel/Frame 049152/0778 →
Change of Name May 20, 2019
From: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
To: ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
Reel/Frame 049234/0641 →