Patent Assignment
Reel/Frame 049234/0641
Change of Name
Recorded: 2019-05-20
Pages: 5
Assignor
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Executed: 2018-01-17
Assignee
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
FOUNDERPCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE, QIANWU, DOUMEN, ZHUHAI, 519173, CHINA
Covered Properties
(12)
Multilayer Electronic Structure with Stepped Holes
Alignment Between Layers of Multilayer Electronic Support Structures
Multilayer Electronic Support Structure with Integral Constructional Elements
Method of Fabrication, a Multilayer Electronic Structure and Structures in Accordance with the Method
Single Layer Coreless Substrate
Novel Terminations and Couplings Between Chips and Substrates
Thin Film Capacitors Embedded in Polymer Dielectric
Multilayer Electronic Structures with Embedded Filters
Composite Electronic Structure with Partially Exposed and Protruding Copper Termination Posts
Single Layer Coreless Substrate
Substrates with Ultra Fine Pitch Flip Chip Bumps
Multilayer Electronic Structures with Embedded Filters
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 21, 2012
From: HURWITZ, DROR; CHAN, SIMON; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 028420/0722 →
Assignment of Assignor's Interest
Jun 25, 2012
From: HURWITZ, DROR; CHAN, SIMON
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 028436/0742 →
Assignment of Assignor's Interest
Jul 23, 2012
From: HURWITZ, DROR; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 028612/0918 →
Assignment of Assignor's Interest
Oct 15, 2012
From: HURWITZ, DROR; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 029131/0042 →
Assignment of Assignor's Interest
Apr 24, 2013
From: HURWITZ, DROR; CHAN, SIMON; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 030277/0900 →
Assignment of Assignor's Interest
Jun 14, 2013
From: HURWITZ, DROR; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 030618/0036 →
Assignment of Assignor's Interest
Aug 13, 2013
From: HURWITZ, DROR; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 030996/0639 →
Assignment of Assignor's Interest
Aug 14, 2013
From: HURWITZ, DROR; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 031004/0557 →
Assignment of Assignor's Interest
Mar 6, 2014
From: HURWITZ, DROR; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 032371/0401 →
Assignment of Assignor's Interest
Jan 15, 2015
From: HURWITZ, DROR; CHAN, XIANMING SIMON; HUANG, SHIH-FU ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 034721/0307 →
Assignment of Assignor's Interest
Jan 31, 2018
From: HURWITZ, DROR; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 044783/0823 →
Assignment of Assignor's Interest
Jul 6, 2018
From: HURWITZ, DROR; HUANG, ALEX
To: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
Reel/Frame 046497/0055 →