IP Library Assignment 028436/0742
Patent Assignment
Reel/Frame 028436/0742

Assignment of Assignor's Interest

Recorded: 2012-06-25 Pages: 3
Assignors
HURWITZ, DROR
Executed: 2012-06-22
CHAN, SIMON
Executed: 2012-06-22
Assignee
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
FOUNDERPCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE, QIANWU, DOUMEN, ZHUHAI, 519173, CHINA
Covered Property (1)
Alignment Between Layers of Multilayer Electronic Support Structures
Patent: 9,137,905 →
Application: 13/531,948 →
Publication: US 2013/0344628
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 20, 2019
From: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
To: ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
Reel/Frame 049234/0641 →