IP Library › Assignment 030277/0900
Patent Assignment
Reel/Frame 030277/0900

Assignment of Assignor's Interest

Recorded: 2013-04-24 Pages: 4
Assignors
HURWITZ, DROR
Executed: 2013-03-18
CHAN, SIMON
Executed: 2013-03-18
HUANG, ALEX
Executed: 2013-03-18
Assignee
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
FOUNDERPCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE, QIANWU, DOUMEN, ZHUHAI, 519173, CHINA
Covered Property (1)
Single Layer Coreless Substrate
Patent: 8,866,286 →
Application: 13/713,550 →
Publication: US 2014/0167234
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 20, 2019
From: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
To: ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
Reel/Frame 049234/0641 →