IP Library › Assignment 034721/0307
Patent Assignment
Reel/Frame 034721/0307

Assignment of Assignor's Interest

Recorded: 2015-01-15 Pages: 4
Assignors
HURWITZ, DROR
Executed: 2013-03-18
CHAN, XIANMING SIMON
Executed: 2013-03-18
HUANG, SHIH-FU ALEX
Executed: 2013-03-18
Assignee
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
FOUNDERPCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE, QIANWU, DOUMEN, ZHUHAI, 519173, CHINA
Covered Property (1)
Single Layer Coreless Substrate
Patent: 8,945,994 →
Application: 14/485,948 →
Publication: US 2014/0377914
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 20, 2019
From: ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
To: ZHUHAI ACCESS SEMICONDUCTOR CO., LTD.
Reel/Frame 049234/0641 →