Patent Assignment
Reel/Frame 044783/0823
Assignment of Assignor's Interest
Recorded: 2018-01-31
Pages: 3
Assignee
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
ACCESS, FOUNDER PCB INDUSTRY PARK, QIANWU, DOUMEN DISTRICT, ZHUHAI, 519175, CHINA
Covered Property
(1)
Substrates with Ultra Fine Pitch Flip Chip Bumps
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.