Patent Assignment
Reel/Frame 028420/0428
Assignment of Assignor's Interest
Recorded: 2012-06-21
Pages: 12
Assignor
HURWITZ, DROR
Executed: 2012-06-20
Assignee
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO. LTD.
FOUNDERPCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE, QIANWU, DOUMEN, ZHUHAI, 519173, CHINA
Covered Properties
(5)
Multilayer Electronic Structures with Integral Vias Extending in in-Plane Direction
Multilayer Electronic Structures with Vias Having Different Dimensions
Multilayer Electronic Structure with Integral Stepped Stacked Structures
Multilayer Electronic Structure with Integral Faraday Shielding
Application:
13/483,207 →
Publication:
US 2013/0322029
Multilayer Electronic Structure with Novel Transmission Lines
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.