IP Library Assignment 028464/0316
Patent Assignment
Reel/Frame 028464/0316

Assignment of Assignor's Interest

Recorded: 2012-06-28 Pages: 8
Assignors
HUO, DONGMING
Executed: 2012-06-09
HU, HONGPO
Executed: 2012-06-09
XIE, CHUNLIN
Executed: 2012-06-06
ZHANG, WANG
Executed: 2012-06-06
Assignees
SHENZHEN BYD AUTO R&D COMPANY LIMITED
PART B, 1/F, BLDG #B2, YUCAN INDUSTRIAL AREA, LANZHU ROAD, SHENZHEN EXPORT PROCESSING ZONE, SHENZHEN GRAND INDUSTRIAL ZONE, SHENZHEN, GUANGDONG, P.R., 518118, CHINA
BYD COMPANY LIMITED
NO. 3009, BYD ROAD, PINGSHAN, SHENZHEN, GUANGDONG, P.R., 518118, CHINA
Covered Property (1)
Epitaxial Wafer for Light Emitting Diode, Light Emitting Diode Chip and Methods for Manufacturing the Same
Patent: 9,093,596 →
Application: 13/536,784 →
Publication: US 2012/0267641
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 10, 2020
From: SHENZHEN BYD AUTO R&D COMPANY LIMITED; BYD COMPANY LIMITED
To: BYD MICROELECTRONICS CO., LTD.
Reel/Frame 051477/0903 →
Change of Name Feb 11, 2021
From: BYD MICROELECTRONICS CO., LTD.
To: BYD SEMICONDUCTOR COMPANY LIMITED
Reel/Frame 055280/0971 →