Patent Assignment
Reel/Frame 028467/0772
Assignment of Assignor's Interest
Recorded: 2012-06-29
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2012-04-23
TSAI, HAO-YI
Executed: 2012-04-23
LEE, CHIEN-HSIUN
Executed: 2012-05-10
LIU, CHUNG-SHI
Executed: 2012-04-23
CHEN, HSIEN-WEI
Executed: 2012-04-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Methods and Apparatus for Solder Connections