Patent Assignment
Reel/Frame 028498/0014
Assignment of Assignor's Interest
Recorded: 2012-07-06
Pages: 3
Assignor
AKADA, HIKARU
Executed: 2012-05-24
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Data Acquisition Method of Substrate Processing Apparatus and Sensing Substrate