Patent Assignment
Reel/Frame 028501/0546
Assignment of Assignor's Interest
Recorded: 2012-07-06
Pages: 6
Assignors
LEE, BONGYONG
Executed: 2012-07-06
KIM, SANG-HOON
Executed: 2012-07-06
LEE, AE-JEONG
Executed: 2012-07-06
KIM, DONGCHAN
Executed: 2012-07-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Devices Using Direct Strapping Line Connections