Patent Assignment
Reel/Frame 028516/0803
Assignment of Assignor's Interest
Recorded: 2012-07-09
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2012-06-18
SHIH, DA-YUAN
Executed: 2012-06-18
TUNG, CHIH-HANG
Executed: 2012-06-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Three-Dimensional Chip Stack and Method of Forming the Same