IP Library › Assignment 028526/0287
Patent Assignment
Reel/Frame 028526/0287

Assignment of Assignor's Interest

Recorded: 2012-07-11 Pages: 4
Assignor
HWANG, DONG WEON
Executed: 2012-07-11
Assignees
HICON CO., LTD.
1002, MEGACENTERDONG, SKN TECHNO PARK, 190-1, SANGDAEWON-DONG, JUNGWON-GU, SEONGNAM-SI, GYEONGGI-DO, 462-721, KOREA, REPUBLIC OF
HWANG, DONG WEON
78-1203, HYUNDAI APT., 456, APGUJEONG-DONG, GANGNAM-GU, SEOUL, 135-788, KOREA, REPUBLIC OF
Covered Property (1)
Structure for a Spring Contact
Patent: 8,715,015 →
Application: 13/521,233 →
Publication: US 2013/0012076