Patent Assignment
Reel/Frame 028531/0587
Assignment of Assignor's Interest
Recorded: 2012-07-11
Pages: 2
Assignors
CHEN, MING-FA
Executed: 2012-05-02
WANG, YU-YOUNG
Executed: 2012-05-02
JAN, SEN-BOR
Executed: 2012-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Through-Substrate Vias and Methods for Forming the Same