Patent Assignment
Reel/Frame 028536/0162
Assignment of Assignor's Interest
Recorded: 2012-07-12
Pages: 6
Assignors
XUE, YAN XUN
Executed: 2012-07-11
YILMAZ, HAMZA
Executed: 2012-07-10
HO, YUEH-SE
Executed: 2012-07-10
LU, JUN
Executed: 2012-07-10
HUANG, PING
Executed: 2012-07-11
SHI, LEI
Executed: 2012-07-11
DUAN, LEI
Executed: 2012-07-11
GONG, YUPING
Executed: 2012-07-11
Assignee
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
475 OAKMEAD PKWY, SUNNYVALE, CALIFORNIA, 94085
Covered Property
(1)
Packaging Method of Molded Wafer Level Chip Scale Package (Wlcsp)