Patent Assignment
Reel/Frame 028549/0028
Assignment of Assignor's Interest
Recorded: 2012-07-13
Pages: 2
Assignors
YEUNG LUKE WAN, MING
Executed: 2012-05-25
WAI CHEUNG, CHI
Executed: 2012-05-25
TUNG SO, CHIN
Executed: 2012-05-25
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Apparatus for Heating a Substrate During Die Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.