Patent Assignment
Reel/Frame 028549/0189
Option
Recorded: 2012-07-13
Pages: 7
Assignor
SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
Executed: 2012-05-03
Assignee
ZAMTEC LIMITED
8 FITZWILLIAM SQUARE, DUBLIN 2, IRELAND
Covered Properties
(20)
Thermal Expansion Relieving Support for Printhead Assembly
Method of Fabricating an Ink Jet Printhead Chip Having Actuator Mechanisms Located About Ejection Ports
Printhead Assembly with Dual Power Supply
Wallpaper Printer
Thermal Ink Jet Printhead with Heater Element Symmetrical About Nozzle Axis
Printhead Having First and Second Rows of Print Nozzles
Dithered Image for Bi-Level Printing
Printhead-To-Platen Variable Spacing Mechanism
Printhead Chip Incorporating Laterally Displaceable Ink Flow Control Mechanisms
Ink Jet Nozzle to Eject Ink
Method of Fabricating Inkjet Nozzles
Method of Fabricating Printhead Ic Using Cte Matched Wafer and Sacrificial Materials
Inkjet Printhead Assembly Having Aligned Printhead Segments
Printhead Module
Ink Jet Module
Ink Jet Printhead Chip with Volumetric Ink Ejection Mechanisms
Method of Fabricating a Micro-Electromechanical Device with a Thermal Actuator
Printhead Integrated Circuit for a Pagewidth Inkjet Printhead
Nozzle Arrangement
Inkjet Printhead Having Ink Flow Preventing Actuators
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.