Patent Assignment
Reel/Frame 028556/0616
Assignment of Assignor's Interest
Recorded: 2012-07-16
Pages: 4
Assignors
CHEN, MENG-TSE
Executed: 2012-05-02
LIN, HSIU-JEN
Executed: 2012-05-02
LIN, CHIH-WEI
Executed: 2012-05-02
CHEN, CHENG-TING
Executed: 2012-05-02
CHENG, MING-DA
Executed: 2012-05-02
LIU, CHUNG-SHI
Executed: 2012-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Stud Bump Structure for Semiconductor Package Assemblies