Patent Assignment
Reel/Frame 028560/0027
Assignment of Assignor's Interest
Recorded: 2012-07-16
Pages: 10
Assignors
WEI, JEN-CHIEH
Executed: 2012-04-26
LIU, ZHIMING
Executed: 2012-04-27
SHI, STEVEN Z.
Executed: 2012-04-27
KUHR, WERNER G.
Executed: 2012-04-24
Assignee
ESIONIC 3000, INC.
1455 ADAMS DRIVE, SUITE 1630, MENLO PARK, CALIFORNIA, 94025
Covered Property
(1)
Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.