IP Library › Assignment 040760/0819
Patent Assignment
Reel/Frame 040760/0819

Assignment of Assignor's Interest

Recorded: 2016-12-23 Pages: 5
Assignor
ESIONIC CORP.
Executed: 2016-07-15
Assignee
NAMICS CORPORATION
3993 NIGORIKAWA, KITA-KU, NIIGATA PREFECTURE, NIIGATA CITY, JAPAN
Covered Properties (2)
Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards
Patent: 9,345,149 →
Application: 13/142,588 →
Publication: US 2012/0125514
Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards
Patent: 9,795,040 →
Application: 15/130,167 →
Publication: US 2017/0027065
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 16, 2012
From: WEI, JEN-CHIEH; LIU, ZHIMING; SHI, STEVEN Z.; KUHR, WERNER G.
To: ESIONIC 3000, INC.
Reel/Frame 028560/0027 →
Merger Apr 27, 2015
From: ESIONIC 3000, INC.
To: ESIONIC CORP.
Reel/Frame 035505/0426 →
Assignment of Assignor's Interest Oct 3, 2016
From: WEI, JEN-CHIEH; LIU, ZHIMING; SHI, STEVEN Z.; KUHR, WERNER G.
To: ESIONIC 3000, INC.
Reel/Frame 039926/0223 →
Merger Oct 4, 2016
From: ESIONIC 3000, INC.
To: ESIONIC CORP.
Reel/Frame 039937/0301 →