Patent Assignment
Reel/Frame 039937/0301
Merger
Recorded: 2016-10-04
Pages: 5
Assignor
ESIONIC 3000, INC.
Executed: 2014-12-02
Assignee
ESIONIC CORP.
1455 ADAMS DRIVE, SUITE 1630, MENLO PARK, CALIFORNIA, 94025
Covered Property
(1)
Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.