Patent Assignment
Reel/Frame 028566/0218
Assignment of Assignor's Interest
Recorded: 2012-07-11
Pages: 3
Assignors
KIM, HYUN-JOONG
Executed: 2012-06-22
CHOI, JANG SEOK
Executed: 2012-06-22
CHOO, CHUL-HWAN
Executed: 2012-06-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Die Packages and Systems Having the Die Packages