Patent Assignment
Reel/Frame 028566/0287
Assignment of Assignor's Interest
Recorded: 2012-07-17
Pages: 9
Assignors
LEE, MING HAN
Executed: 2012-07-12
CHEN, HAI-CHING
Executed: 2012-07-12
LEE, HSIANG-HUAN
Executed: 2012-07-12
BAO, TIEN-I
Executed: 2012-07-12
TENG, CHI-LIN
Executed: 2012-07-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Novel Copper Etch Scheme for Copper Interconnect Structure