Patent Assignment
Reel/Frame 028582/0856
Assignment of Assignor's Interest
Recorded: 2012-07-11
Pages: 3
Assignors
KIM, YOUNG LYONG
Executed: 2012-06-23
KIM, TAEHOON
Executed: 2012-07-02
LEE, JONGHO
Executed: 2012-07-02
JANG, CHUL-YONG
Executed: 2012-07-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages and Methods of Forming the Same