Assignment of Assignor's Interest

Recorded: 2012-07-19 Pages: 2

Assignor

SUGANO, SUSUMU

Executed: 2012-07-05

Assignee

SHOWA DENKO K.K.

13-9 SHIBA DAIMON 1-CHOME, MINATO-KU, TOKYO, 1058518, JAPAN

Covered Property (1)

Method for Producing Semiconductor Wafer

Patent: 8,637,336 →

Application: 13/574,186 →

Publication: US 2012/0295383

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.