Patent Assignment
Reel/Frame 028605/0327
Assignment of Assignor's Interest
Recorded: 2012-07-21
Pages: 2
Assignors
LO, SUT-I
Executed: 2012-07-12
HSIAO, CHING-WEN
Executed: 2012-07-11
CHEN, HSU-HSIEN
Executed: 2012-07-12
CHEN, CHEN-SHIEN
Executed: 2012-07-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structures Including a Capacitor and Methods of Forming the Same